The University of Washington today announced a multimillion-dollar gift to establish the Winbond Endowed Fund for Excellence in the College of Engineering, supporting research, education and innovation for students, faculty and staff.
The $12 million gift from Winbond Electronics Corporation America, a U.S. subsidiary of Taiwan-based Winbond Electronics Corporation, a global semiconductor company and leading provider of memory and integrated circuit solutions, provides the College with the flexibility to make strategic investments in exceptional people, promising ideas and emerging opportunities.