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Instructor Class Description

Time Schedule:

Junlan Wang
M E 599
Seattle Campus

Special Projects

Written report required. Prerequisite: permission of department chairperson. Offered: AWSpS.

Class description

This course aims to provide an overview of the thin film deposition processes, the stress and microstructure development during film growth, the mechanisms of adhesion, delamination and fracture, and the state-of-the-art characterization techniques for the microstructure and mechanical properties for thin films and nanomaterials. Students will get hands on experience through performing a self-selected thin film fabrication and characterization project.

Student learning goals

Thin film deposition method, growth mode, microstructure evolution

Stress development during film growth, Stoney equation

Mechanisms of Adhesion, delamination and fracture in thin films

Thin film buckling, bulging and peeling

State-of-the-art techniques for thin film deposition, microstructure and mechanical characterization

General method of instruction

Lecture, discussion, lab demonstration and hands on project

Recommended preparation

Basic knowledge in mechanics and materials. This course is recommended for graduate students and undergraduate seniors who have a general mechanics and materials background.

Class assignments and grading

About 3-4 homework assignments throughout the quarter; One mid-term exam based on the lecture; One project in any sub-areas of thin film mechanics.

Homework 30%; midterm - 40%; project - 30%


The information above is intended to be helpful in choosing courses. Because the instructor may further develop his/her plans for this course, its characteristics are subject to change without notice. In most cases, the official course syllabus will be distributed on the first day of class.
Last Update by Junlan Wang
Date: 09/20/2011