Time Schedule:
Junlan Wang
M E 599
Seattle Campus
Written report required. Prerequisite: permission of department chairperson. Offered: AWSpS.
Class description
This course aims to provide an overview of the thin film deposition processes, the stress and microstructure development during film growth, the mechanisms of adhesion, delamination and fracture, and the state-of-the-art characterization techniques for the microstructure and mechanical properties for thin films and nanomaterials. Students will get hands on experience through performing a self-selected thin film fabrication and characterization project.
Student learning goals
Thin film deposition method, growth mode, microstructure evolution
Stress development during film growth, Stoney equation
Mechanisms of Adhesion, delamination and fracture in thin films
Thin film buckling, bulging and peeling
State-of-the-art techniques for thin film deposition, microstructure and mechanical characterization
General method of instruction
Lecture, discussion, lab demonstration and hands on project
Recommended preparation
Basic knowledge in mechanics and materials. This course is recommended for graduate students and undergraduate seniors who have a general mechanics and materials background.
Class assignments and grading
About 3-4 homework assignments throughout the quarter; One mid-term exam based on the lecture; One project in any sub-areas of thin film mechanics.
Homework 30%; midterm - 40%; project - 30%
