Time Schedule:
Junlan Wang
M E 461
Seattle Campus
Provides an overview of the thin film deposition processes; the stress and microstructure development during film growth; the mechanisms of adhesion; delamination and fracture; and the state-of-the-art characterization techniques for the microstructure and mechanical properties of thin films, coatings, and nanomaterials. Offered: A.
Class description
Thin films play important roles in many technological applications including microelectronics devices, magnetic storage media and surface coatings. Although the principal function of thin films in these applications may not be structural, and consequently the load carrying capacity of the thin films may not be the major factor for design and material selection, the fabrication of thin film configuration often results in internal stress in the film of a magnitude sufficient to induce mechanical deformation, damage or failure, which may eventually affect the electrical or magnetic properties in the functional devices. This course aims to provide an overview of the thin film deposition processes, the stress and microstructure development during film growth, the mechanisms of adhesion, delamination and fracture. And the state-of-the-art characterization techniques for the microstructure and mechanical properties for thin film and small-scale materials and structures.
Student learning goals
General method of instruction
Powerpoint, Boardwriting, Discussion and Lab Demo Both traditional and non-traditional
Recommended preparation
Undergraduate senior or graduate students standing
Class assignments and grading
4-5 homeworks one midterm exam one course project
Hw, project and exam
